A percolative simulation of electromigration phenomena

Resistance degradation of metallic strips due to electromigation is studied within a percolative approach based on a random resistor network. Both defect generation and recovery driven by a current stress are considered. The main features of experiments performed on Al-0.5%Cu lines are well reproduced, thus providing a unified description of degradation processes in terms of physical parameters. (C) 2001 Elsevier Science B.V. All rights reserved.