A simple test method for measurement of the interface thermal resistance of coated and uncoated metal surfaces
Contributo in Atti di convegno
Data di Pubblicazione:
2020
Citazione:
A simple test method for measurement of the interface thermal resistance of coated and uncoated metal surfaces / Pedrazzi, Simone; Vergnano, A.; Allesina, G.; Veronesi, Paolo; Leali, F.; Tartarini, P.; Muscio, A.. - In: JOURNAL OF PHYSICS. CONFERENCE SERIES. - ISSN 1742-6588. - 1599:1(2020), p. 012049. ( 37th UIT Heat Transfer Conference and Symposium Refrigerants: Heat Transfer and Applications Padova 24-26 June 2019) [10.1088/1742-6596/1599/1/012049].
Abstract:
Molds for metal casting are often internally coated in order to minimize the interaction between the steel surface of the mold and the melted metal during its pouring and solidification. However, the added coating increases the thermal interface resistance during the cooling process and it can thus affect the process itself. For example, numerical predictions and experimental results are matched only if the interface resistance is even quintupled in the presence of the usual interface coating, compared to the uncoated mold. In order to have a reasonable estimate of the interface thermal resistance, an easy to use measurement approach has been tested. This consists of contacting a cold and a hot samples of metals with known thermal properties, one at ambient temperature and the other one much hotter. The temperatures of the two samples, assumed to be uniform in each sample, are measured by thermocouples placed inside the samples through a hole, and the interface resistance is calculated from the time evolution pattern of those temperatures during the thermal transient that follows the instant in which the samples have been contacted.
Tipologia CRIS:
Relazione in Atti di Convegno
Keywords:
Die Castings, Heat Transfer Coefficients, Solidification
Elenco autori:
Pedrazzi, Simone; Vergnano, A.; Allesina, G.; Veronesi, Paolo; Leali, F.; Tartarini, P.; Muscio, A.
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Titolo del libro:
Journal of Physics: Conference Series
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