Skip to Main Content (Press Enter)

Logo UNIMORE
  • ×
  • Home
  • Corsi
  • Insegnamenti
  • Professioni
  • Persone
  • Pubblicazioni
  • Strutture
  • Terza Missione
  • Attività
  • Competenze

UNI-FIND
Logo UNIMORE

|

UNI-FIND

unimore.it
  • ×
  • Home
  • Corsi
  • Insegnamenti
  • Professioni
  • Persone
  • Pubblicazioni
  • Strutture
  • Terza Missione
  • Attività
  • Competenze
  1. Pubblicazioni

An Empirical Model for RRAM Resistance in Low- and High-Resistance State

Articolo
Data di Pubblicazione:
2013
Citazione:
An Empirical Model for RRAM Resistance in Low- and High-Resistance State / Puglisi, Francesco Maria; Larcher, Luca; G., Bersuker; Padovani, Andrea; Pavan, Paolo. - In: IEEE ELECTRON DEVICE LETTERS. - ISSN 0741-3106. - ELETTRONICO. - 34:3(2013), pp. 387-389. [10.1109/LED.2013.2238883]
Abstract:
We present a simple empirical expression describing hafnium-based RRAM resistance at different reset voltages and current compliances. The model that we propose describes filament resistance measured at low (∼0.1 V) reading voltage in both low-resistance state (LRS) and high-resistance state (HRS). The proposed description confirms that conduction in LRS is ohmic (after forming with a sufficiently high current compliance) and is consistent with the earlier description of HRS resistance as controlled by a trap-assisted electron transfer via traps in the oxidized portion of the filament. The length of the nonohmic part of the filament is found to be directly proportional to reset voltage. Moreover, low-frequency noise measurements at different reset voltages evidence a tradeoff between HRS resistance and noise in reading conditions.
Tipologia CRIS:
Articolo su rivista
Keywords:
compact model; filamentary conduction; HfOx; low-frequency noise (LFN); nonvolatile memories (NVMs); RRAM
Elenco autori:
Puglisi, Francesco Maria; Larcher, Luca; G., Bersuker; Padovani, Andrea; Pavan, Paolo
Autori di Ateneo:
PADOVANI ANDREA
PAVAN Paolo
PUGLISI Francesco Maria
Link alla scheda completa:
https://iris.unimore.it/handle/11380/919689
Pubblicato in:
IEEE ELECTRON DEVICE LETTERS
Journal
  • Utilizzo dei cookie

Realizzato con VIVO | Designed by Cineca | 26.5.0.0