Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes

Conference Paper

Publication Date:

2018

Short description:

Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes / Dazzi, Martino; Palestri, Pierpaolo; Rossi, Davide; Bandiziol, Andrea; Loi, Igor; Bellasi, David; Benini, Luca. - 2018-:(2018), pp. 1-5. ( 2018 IEEE International Symposium on Circuits and Systems, ISCAS 2018 Firenze 27-30 giugno) [10.1109/ISCAS.2018.8351893].

Iris type:

Relazione in Atti di Convegno

Keywords:

energy efficiency; internet of things; low-swing serial link; near sensor processing;

List of contributors:

Dazzi, Martino; Palestri, Pierpaolo; Rossi, Davide; Bandiziol, Andrea; Loi, Igor; Bellasi, David; Benini, Luca

Authors of the University:

PALESTRI Pierpaolo

Handle:

https://iris.unimore.it/handle/11380/1328057

Book title:

2018 IEEE International Symposium on Circuits and Systems (ISCAS)

Published in:

IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS PROCEEDINGS

Journal