Skip to Main Content (Press Enter)

Logo UNIMORE
  • ×
  • Home
  • Corsi
  • Insegnamenti
  • Professioni
  • Persone
  • Pubblicazioni
  • Strutture
  • Terza Missione
  • Attività
  • Competenze

UNI-FIND
Logo UNIMORE

|

UNI-FIND

unimore.it
  • ×
  • Home
  • Corsi
  • Insegnamenti
  • Professioni
  • Persone
  • Pubblicazioni
  • Strutture
  • Terza Missione
  • Attività
  • Competenze
  1. Pubblicazioni

Impact of High-Mobility Materials on the Performance of Near- and Sub-Threshold CMOS Logic Circuits

Articolo
Data di Pubblicazione:
2013
Citazione:
Impact of High-Mobility Materials on the Performance of Near- and Sub-Threshold CMOS Logic Circuits / Crupi, F; Albano, D; Alioto, M; Franco, J; Selmi, Luca; Mitard, J; Groeseneken, G.. - In: IEEE TRANSACTIONS ON ELECTRON DEVICES. - ISSN 0018-9383. - STAMPA. - 60:3(2013), pp. 972-977. [10.1109/TED.2013.2240685]
Abstract:
This paper studies the impact of high-mobility materials on the performance and energy efficiency of near- and sub- threshold CMOS logic circuits by means of analytical equations and experimental data on SiGe pMOSFETs. The introduction of high-mobility materials is shown to improve the energy- performance trade-off in near-threshold circuits more than in above-threshold circuits, since the benefits of higher mobility are degraded at higher longitudinal and transversal electric fields. On the other hand, results show that high-mobility materials do not exhibit any advantage in terms of the energy-performance trade-off in sub-threshold logic circuits. This is explained by the fact that the benefits brought by the larger mobility of SiGe or other alternative materials can be obtained by tuning the threshold voltage of conventional Si devices.
Tipologia CRIS:
Articolo su rivista
Keywords:
High-mobility materials; near-threshold CMOS circuits; SiGe pMOSFETs; sub-threshold CMOS circuits
Elenco autori:
Crupi, F; Albano, D; Alioto, M; Franco, J; Selmi, Luca; Mitard, J; Groeseneken, G.
Autori di Ateneo:
SELMI LUCA
Link alla scheda completa:
https://iris.unimore.it/handle/11380/1163144
Pubblicato in:
IEEE TRANSACTIONS ON ELECTRON DEVICES
Journal
  • Utilizzo dei cookie

Realizzato con VIVO | Designed by Cineca | 26.4.5.0