Multiscale modeling of neuromorphic computing: From materials to device operations
Contributo in Atti di convegno
Data di Pubblicazione:
2018
Citazione:
Multiscale modeling of neuromorphic computing: From materials to device operations / Larcher, L.; Padovani, A.; Di Lecce, V.. - (2018), pp. 11.7.1-11.7.4. ( 63rd IEEE International Electron Devices Meeting, IEDM 2017 usa 2017) [10.1109/IEDM.2017.8268374].
Abstract:
In this paper, a multiscale modeling platform for neuromorphic computing devices connecting the atomic material properties to the electrical device performances is presented. The main ingredients of the modeling platform are discussed in view of the different technologies (e.g. RRAM, PCM, FTJ) proposed for 3D integrated neuromorphic computing.
Tipologia CRIS:
Relazione in Atti di Convegno
Elenco autori:
Larcher, L.; Padovani, A.; Di Lecce, V.
Link alla scheda completa:
Titolo del libro:
Technical Digest - International Electron Devices Meeting, IEDM
Pubblicato in: