Skip to Main Content (Press Enter)

Logo UNIMORE
  • ×
  • Home
  • Corsi
  • Insegnamenti
  • Professioni
  • Persone
  • Pubblicazioni
  • Strutture
  • Terza Missione
  • Attività
  • Competenze

UNI-FIND
Logo UNIMORE

|

UNI-FIND

unimore.it
  • ×
  • Home
  • Corsi
  • Insegnamenti
  • Professioni
  • Persone
  • Pubblicazioni
  • Strutture
  • Terza Missione
  • Attività
  • Competenze
  1. Pubblicazioni

A Compact Model of Program Window in HfOx RRAM Devices for Conductive Filament Characteristics Analysis

Articolo
Data di Pubblicazione:
2014
Citazione:
A Compact Model of Program Window in HfOx RRAM Devices for Conductive Filament Characteristics Analysis / Larcher, Luca; Puglisi, Francesco Maria; Pavan, Paolo; Padovani, Andrea; Vandelli, Luca; Bersuker, Gennadi. - In: IEEE TRANSACTIONS ON ELECTRON DEVICES. - ISSN 0018-9383. - STAMPA. - 61:8(2014), pp. 2668-2673. [10.1109/TED.2014.2329020]
Abstract:
This paper presents a physics-based compact model for the program window in HfOx resistive random access memory devices, defined as the ratio of the resistances in high resistance state (HRS) and low resistance state (LRS). This model allows extracting the characteristics of the conductive filament (CF) in HRS. For a given forming current compliance limit, the program window is shown to be correlated to the thickness of the reoxidized portion of the CF in HRS, which can be modulated by the reset voltage amplitude. On the other hand, the statistical distribution of the memory window depends exponentially on the barrier thickness variations that points to the critical role of reset conditions for the performance optimization of RRAM devices.
Tipologia CRIS:
Articolo su rivista
Keywords:
Charge transport, compact modeling, non-volatile memories
Elenco autori:
Larcher, Luca; Puglisi, Francesco Maria; Pavan, Paolo; Padovani, Andrea; Vandelli, Luca; Bersuker, Gennadi
Autori di Ateneo:
PADOVANI ANDREA
PAVAN Paolo
PUGLISI Francesco Maria
Link alla scheda completa:
https://iris.unimore.it/handle/11380/1061652
Pubblicato in:
IEEE TRANSACTIONS ON ELECTRON DEVICES
Journal
  • Utilizzo dei cookie

Realizzato con VIVO | Designed by Cineca | 26.4.5.0