Data di Pubblicazione:
2010
Citazione:
Microwave rapid debinding and sintering of MIM/CIM parts / Veronesi, Paolo; Leonelli, Cristina; Poli, Giorgio; Denti, Lucia; Gatto, Andrea. - STAMPA. - 209:(2010), pp. 259-270. ( Advances in Sintering Science and Technology - International Conference on Sintering 2008 La Jolla, CA, usa 2008) [10.1002/9780470599730.ch26].
Abstract:
Thermal debinding of parts obtained by Metal Injection Moulding (MIM) or Ceramic Injection Moulding (CIM) can benefit from the rapid, volumetric and selective microwave-assisted heating, having the organic binder or the metallic powders to preferentially absorb microwaves. This is particularly useful when dealing with ceramic powders having low thermal conductivity, but also more conductive materials can be treated faster if the maximum temperature difference inside each part is kept low. Microwave assisted debinding and sintering of MIM/CIM parts, made of stainless steel and alumina, has been optimized by means of numerical simulation, in order to determine the most favorable load configuration, in terms of heat generation homogeneity and energy efficiency. Rapid microwave-assisted debinding, in the optimized loading conditions, was experimentally achieved, with time reduction from 6 to 8 times, compared to conventional processes. Moreover, in case of MIM, pre-sintering of the brown part occurred, despite the temperature lower than 600°C. The occurrence of this beneficial phenomenon, which improves the brown part mechanical properties, has been ascribed to the electromagnetic field concentration which takes place in the space between the conductive particles, thus promoting rapid binder removal and neck formation.
Tipologia CRIS:
Relazione in Atti di Convegno
Keywords:
Ceramics and Composites; Materials Chemistry2506 Metals and Alloys
Elenco autori:
Veronesi, Paolo; Leonelli, Cristina; Poli, Giorgio; Denti, Lucia; Gatto, Andrea
Link alla scheda completa:
Titolo del libro:
Advances in Sintering Science and Technology: Ceramic Transactions
Pubblicato in: