A comparison between normally and highly accelerated electromigration tests

Articolo

Data di Pubblicazione:

1998

Citazione:

A comparison between normally and highly accelerated electromigration tests / Foley, S.; Scorzoni, A.; Balboni, R.; Impronta, M.; De Munari, I.; Mathewson, A.; Fantini, Fausto. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - STAMPA. - 38:(1998), pp. 1021-1027. [10.1016/S0026-2714(98)00121-6]

Abstract:

Normally and highly accelerated electromigration tests on Al-Cu lines of different widths are compared.

Tipologia CRIS:

Articolo su rivista

Keywords:

Electromigration

Elenco autori:

Foley, S.; Scorzoni, A.; Balboni, R.; Impronta, M.; De Munari, I.; Mathewson, A.; Fantini, Fausto

Link alla scheda completa:

https://iris.unimore.it/handle/11380/451761

Pubblicato in:

MICROELECTRONICS RELIABILITY

Journal