Data di Pubblicazione:
1986
Citazione:
Reliability evaluation of plastic packaged devices for long life applications by THB test / P., Brambilla; C., Canali; Fantini, Fausto; F., Magistrali; G., Mattana. - In: MICROELECTRONICS RELIABILITY. - ISSN 0026-2714. - STAMPA. - 26:(1986), pp. 365-384. [10.1016/0026-2714(86)90732-6]
Abstract:
The reliability of transistors, bipolar and CMOS integrated circuits encapsulated in different types of plastic packages was investigated by using the 85°C/85%R.H. test with applied bias and thr results compared with a long term operating life test.
Tipologia CRIS:
Articolo su rivista
Keywords:
Reliability.
Plastic package.
Temperature-humidity-bias test.
Elenco autori:
P., Brambilla; C., Canali; Fantini, Fausto; F., Magistrali; G., Mattana
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