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Surface-related drain current dispersion effects in AlGaN-GaN HEMTs

Articolo
Data di Pubblicazione:
2004
Citazione:
Surface-related drain current dispersion effects in AlGaN-GaN HEMTs / Meneghesso, G.; Verzellesi, Giovanni; Pierobon, R.; Rampazzo, F.; Chini, Alessandro; Mishra, U. K.; Canali, Claudio; Zanoni, E.. - In: IEEE TRANSACTIONS ON ELECTRON DEVICES. - ISSN 0018-9383. - STAMPA. - 51:10(2004), pp. 1554-1561. [10.1109/TED.2004.835025]
Abstract:
Drain current dispersion effects are investigated in AlGaN-GaN HEMTs by means of pulsed, transient, and small-signal measurements. Gate- and drain-lag effects characterized by time constants in the order of 10-100 us cause dispersion between dc and pulsed output characteristics when the gate or the drain voltage are pulsed. An activation energy of 0.3 eV is extracted from temperature-dependent gate-lag measurements. We show that two-dimensional numerical device simulations accounting only for polarization charges and donor-like traps at the ungated AlGaN surface can quantitatively reproduce all dispersion effects observed experimentally in the different pulsing modes, provided that the measured activation energy is adopted as the energetic distance of surface traps from the valence-band edge. Within this hypothesis, simulations show that surface traps behave as hole traps during transients, interacting with holes attracted at the AlGaN surface by the negative polarization charge.
Tipologia CRIS:
Articolo su rivista
Keywords:
AlGaN-GaN HEMTs; current collapse; deep levels; traps; numerical device simulation.
Elenco autori:
Meneghesso, G.; Verzellesi, Giovanni; Pierobon, R.; Rampazzo, F.; Chini, Alessandro; Mishra, U. K.; Canali, Claudio; Zanoni, E.
Autori di Ateneo:
CHINI Alessandro
VERZELLESI Giovanni
Link alla scheda completa:
https://iris.unimore.it/handle/11380/305853
Pubblicato in:
IEEE TRANSACTIONS ON ELECTRON DEVICES
Journal
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URL

http://ieeexplore.ieee.org/document/1337164/
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